Novel Channels and 3D Nanoelectronics
Atomic Layer Deposition, Oxide Semiconductors, P-Type Channel Materials, Monolithic Integration.
We develop and study ALD thin films channel materials such as InO
x
and Te for next-generation back-end-of-line (BEOL) compatible applications. ALD offers precise
thickness control and excellent uniformity, enabling large-area integration
on various substrates.
Our work begins with fundamental device physics and pushes the limits of transistor behavior.
By carefully managing thermal budgets and combining process optimization with detailed device characterization,
we aim to achieve high mobility, low contact resistance, and excellent reliability in BEOL transistors.